HP

IHA Packaging Engineer

Batu Kawan, Pulau Pinang (Penang), Malaysia Full time
IHA Packaging Engineer

Description -

We are seeking a detail-oriented and innovative Packaging Engineer to design, develop, and optimize packaging solutions that ensure product protection, cost efficiency, sustainability, and compliance with industry standards. The ideal candidate will collaborate cross-functionally with design, manufacturing, quality, and supply chain teams to deliver high-performance packaging systems.

Responsibilities

  • Design and develop packaging solutions for new and existing products, balancing functionality, aesthetics, sustainability, and cost.
  • Lead packaging-related projects across sites (Crv and SG).
  • Conduct packaging testing and validation to ensure compliance with performance standards (e.g., ISTA, ASTM).
  • Collaborate with suppliers and internal teams to evaluate packaging materials and technologies.
  • Support manufacturing and logistics teams in packaging implementation and troubleshooting.
  • Drive continuous improvement initiatives to reduce packaging waste and improve efficiency.
  • Ensure packaging meets regulatory, environmental, and customer requirements.
  • Create and maintain packaging documentation including specifications, drawings, and test reports.
  • Update and manage engineering documentation, including work instructions, process flows, and FMEAs.
  • Flexibly rotate to other engineering or operational processes as required by business needs, contributing to cross-functional initiatives and organizational agility.

Education And Experience Required

  • Bachelors in a manufacturing-related engineering discipline or equivalent.
  • Typically, 4-6 years’ experience in packaging or process engineering.
  • Experience with process documentation and strong problem solving.

Knowledge And Skills

  • Using engineering tools and software packages to design and automate manufacturing processes with strong analytical and problem-solving skills.
  • Understanding of material properties and hardware and electrical component design.
  • Using empirical analysis, modeling and methodologies to validate manufacturing process and tooling design and specifications.
  • Excellent communication and collaboration abilities. Mastery of English and local language.
  • Ability to effectively communicate manufacturing plans, proposals, and results, and negotiate options at management levels.

Job -

Engineering

Schedule -

Full time

Shift -

No Shift premium (Malaysia)

Travel -

Relocation -

Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"